Products

 

Temperature Converter

Enter a number
& click on
the "Calculate" button
°F= °C

 

e-Ion Zapper™ Furnace

e-ion Models  Available

Box Furnaces Tube Furnaces Specialty Ovens Panels & Accessories
Box Furnaces
Bottom Loading
Top Hat Furnaces
Tunnel Furnaces
Front Loading

Vertical/Split
Bottom Loading Tube Furnace
Stackable Modules
Horizontal Tube Furnace - Laboratory Scale
Horizontal Tube Furnace - Industrial Scale

 Hybrid Furnaces
Tensile Testing
Thermoplate
PC Concentrator
Zapper
Compact Slider		 Recirculating Ovens
Continuous Oven
Custom Convective Ovens		 Single Phase SCR's
3 Phase SCR's
Electric Controllers
Data Acquisition System
MHI-8DATALOG

What is e-Ion Plasma™? - Features of Plasma (Brochure) - Extremely Wide Area Plasma (with LIP)


MHI's e-Ion Zapper™ Furnace's Clean ElectricFlame™ uses a unique combination of Ions, Electrons, Radiation and hot gases to achieve an unparalleled heat up rate of 200°C/second, all while minimizing emissions. The e-Ion Zapper™ Furnace features high plume uniformity, numerous safety features and unprecedented energy efficiency. All e-Ion Plasma™ devices feature patented technologies developed by MHI.

Zapper Models  Available
The unique e-Ion Plasma™ allows for unique applications of Ions, Electrons, Radiation and Hot Gases. The e-Ion Plasma™ produces a CleanElectricFlame™. This thermal plasma technology platform offers clean-green technology that can use just electricity and air, leaving behind no residues. It is a new alternative to electron, laser, induction, and other Rapid Thermal Process heating methods. MHI's e-Ion Plasma™ uses less energy, produces less noise and is safer than traditional heating methods. All e-Ion Plasma™ devices feature integrated patented technologies developed by MHI. Other features

of e-Ion Plasma™ include: Highly efficient low power consumption, no water cooling, no ground electrode required and very small foot print.

Plasma polymerization of many unique polymers and blends and their surface deposits remain unexplored with this new method.
e-Ion Plasma Clean ElectricFlame
e-Ion Plasma™ Source | e-Ion Zapper™ Furnace | Gen3 LIP System



e-Ion Plasma™ Plume		 e-Ion Zapper Furnace
e-Ion Zapper™ Furnace		 e-Ion Zapper Furnace
e-Ion Zapper™ Furnace		 e-Ion Plasma Controlse-Ion Zapper™ Controls


The e-Ion Zapper™ Furnace uses a scalable CleanElectricFlame™ technology platform to provide non-contact, continuous heating with accurate temperature control in a compact, versatile design. The e-ion Zapper Furnace allows for processes to complete while cable or wire are moving through the furnace both normal and in line with plasma.

e-Ion Zapper™ Furnaces are capable of delivering the rapid heat rate needed for melting brazing and heat treating. The e-Ion Zapper™ is ideal for applications requiring hardening with extremely small HAZ, because it allows for a lower residence time than with traditional heating methods such as induction. The e-Ion Zapper™ allows for rapid processing in air as well as a number of other gases.

Processes can be completed while wire or cable is moving through the e-Ion Plasma™ environment. This type of heating provides the rapid high temperatures necessary to melt and heat treat. e-Ion™ devices feature higher heat up rates compared to competitors. The e-Ion Zapper™ Furnace allows for easy manipulation of parts, all within 15kW of power. Compare the e-Ion Zapper™ Furnace to existing technologies and you'll quickly see how an e-Ion Zapper™ Furnace can reduce costs and improve efficiency.

For More Details Contact Us Online or call us at 513-772-0404.  Zapper Models  Available

Technical Specifications


e-Ion Zapper™ Furnace Technical Specifications


200°C/s Heat-up Rate
9-15kW Power Consumption (Depending on Configuration)
Highly Modular
Compact Table Top Sized
Highly Accurate Controls
No Water Cooling Required
Ability to Treat Ungrounded Metals
Stainless Steel Construction, Integrated Fan
No Toxic Emissions or Combustion Residues
220/230/240 Input Voltages
Single Phase or 3 Phase
Near Silent Operation
Plume Properties
Recombination Temperature ~2500°K
Convective Plasma (variable gas temperature is up to 1600°K)
Heat Transfer Coefficient ~225W/m^2.K.(Compare to 10W/m^2.K)
Example of Plasma Formation - N2+E ->N2++ e or
2N+E -> 2N+ +2e
Example of Plasma Recombination - 2N+ + 2e -> 2N + E or
2N -> N2 + E

Possible species include O2, N2, O2+ , N2+ , N, O, N+, O+, e−, in e-Ion Plasma of air

Possible species include N2, , N2+ , N+,, e−,in e-Ion Plasma of nitrogen.

Many elemental or molecular gasses/species can be ionized including Ar, Xe, H2O and others.

Request Information Online, Email-Us or Call 513-772-0404 for More Information

Applications


e-Ion Zapper™ Furnace Applications

Zapper™ Systems provide non-contact, continuous heating with accurate temperature control in compact versatile use designs.

 

Specific Application Information
For knife-edge, wire and cable applications, the e-Ion Zapper™ system can provide normalizing, stress relieving, annealing, hardening, curing, surface melting and coating. Processes may be completed while wire or cable is moving through the e-Ion Plasma™ environment. This type heating provides the rapid high temperature heating necessary for melting and heat treating.
Uses
Stress Relieving
Annealing
Aluminum Dross Prevention
Hardening, Brazing
Curing, ElectricFlame Sterile.  Plasma Ideation Brochure.
Surface Melting
Surface Coating
Hard-facing
Sintering Powder
Compacting to Substrate
Forming Coatings (Rapid Manufacturing of Tungsten Carbide-Co Alloys with Excellent Bonding on any Metal Platforms).  Unique Depositions.
Creating High Hardness Surfaces
Creating/Treating Highly Wear/Abrasion Resistant Surfaces

 

 

e-Ion Plasma™ powered devices have a much higher heat up rate compared to existing technologies such as induction, lasers and electron beams.The e-Ion Zapper™ Furnace allows for easy manipulation of parts, all within 15kW of power. The e-Ion Zapper™ Furnace reduces costs and improves efficiency.


Request Information Online, Email-Us or Call 513-772-0404 for More Information

Features


e-Ion Zapper™ Furnace Features

The e-Ion Zapper™ Furnace is designed for quick heat-up applications at very high temperatures, from simple heat treatment to complicated profiles of electronics and materials processing. The e-Ion Zapper™ Furnace offers high temperature uniformity and an unmatched rapid heat-up rate of 200°C/second.  (Heating rate obtained from time to melt tests.)

Features
The e-Ion Zapper™ Furnace features an extremely uniform temperature zone.
Eurotherm process controller capable of up to 20 programs with 16 segments per program.
RS 232/485 Communications option available to connect to PC.  
Power controller featuring double back-to-back phase angle fired SCRs, with current limit, adjustable soft start, and quick response to control signal.
Equipped with over-temperature control through an independent thermocouple to monitor overheating.
Up to eight thermocouples for monitoring temperature at different locations.
 

 

The HIPAN™ control panel rests inside a NEMA enclosure that meets NEC and NFPA requirements for safety and reliability.

*SDPM position (custom orders only) controller handles up to 10 programs with an unlimited number of steps, time delays, and repetitions. Programmer has a non-volatile memory of 32 KB for over 100,000 hours.  Computer interface control system has complete DDE dynamic data exchange by SCADA/Windows software which provides nine simultaneous communication ports.

Introductory Pricing available for Steel Heat Treating, Plasma Nitriding and wide-area Semiconductor RTP applications.

Vacuum and atmosphere attachments available.  The Plasma creates its own clean environment in air! Request Information Online, Email-Us or Call 513-772-0404 for More Information

Plasma Uses

Plasma Uses

MHI's unique e-Ion Plasma™ features novel technology that allows it to replace existing processes while simultaneously improving efficiency and productivity. Immerse in CleanElectricFlame™ for non line-of-sight processing or bend-heat requirements. Compare with Laser. 

e-Ion Plasma™ Uses
Rapid Degreasing and Stripping Rapid Deburring and Smoothing from Metals to Plastics.  Smooth Finishing.
Nickel or Cobalt Alloy Brazing and Hardfacing (call for details) Surface treatment without grounding object. Connect to gas and electric.

Plastic Surface Functional Manipulation (please download ideation brochure).  Plasma Ideation Brochure.

 

 Heat Treatment for hardening and other processes.  Please click on comparison tabs above.
Denaturing Decontamination

Electron beam replacement

 Corona Alternative

Electron Beam Furnace

 Smoothing and conditioning.
Compare to electron beam or laser welding Cleaning extruded plastics.  Avoid toxic chemicals.  Unique power adjustments possible.  Plasma Ideation Brochure.

Compare to electron or laser beam Melting

 Induction Heat Treating

Improving surface adhesion.  Cause functionalization.

 Compare to Induction Heat Treating

EB Welding support

Extremely Wide Area Plasma (with LIP)

Compare to Induction Melting.  Please download aluminum processing brochure,

Download Plasma Applications for Aluminum Supplement.
Laser Welding support Surface Cleaning
Enable Plastic Welding Enable Seam Welding.  Dissimilar Materials.
Thin Film Deposition Deposition
Rapid Annealing Rapid Thermal Processing

Surface Deposition


Comparison of Surface Deposition Techniques

  e-Ion Plasma™ Laser Electron Beam

Deposit Rate

 Very high, continuous Medium Medium, discontinuous

Species Deposited

 Atoms and Ions Atoms and Ions Mostly Atoms

Complex Shaped Objects

 Good/Excellent, varying uniformity Good Poor, based on line of sight

Alloy Depositing

 Yes Yes Yes

Simultaneous Gas Heating

 Yes No No
Substrate Heating Yes Low Yes

Request Information Online, Email-Us or Call 513-772-0404 for More Information

e-Ion Compared

Comparisons with Induction Heating and
Comparisons with directed energy systems (Laser to Sunlight)

  e-Ion Plasma™ Laser Electron Beam Sunlight

Induction

Heating

Surface Impact

 Beam up to 150mm, large impact, improves productivity.  Large area allows for CleanElectricFlame soaking at various power settings. Commonly available average beam size is less than 2mm Commonly less than 0.5mm beam Varies Variable depends on frequency of L/C circuit

Welding/Joining

 Yes, even for dissimilar materials Yes, limited by beam parameters Yes, limited by beam parameters N/A N.A

Drilling

 N/A Yes Yes

Vacuum Always Required?

 No.  Plasmize Air to cut down on cost of input gas. No Yes

Power Density

 106-109 W/m2 106-108 W/m2 for commonly used industrial CO2 continuous lasers. Depends on laser type. ~106 W/m2 Depends on acceleration voltage and wavelength of beam 1.3x103 W/m2 (average) Variable
Water Requirement None.  High Energy Efficiency. High High N/A Yes

Energy Efficiency

 Very high Very low Very low N/A Low

Request Information Online, Email-Us or Call 513-772-0404 for More Information


 

Learn how e-Ion Plasma™ technology can improve your business. Download Plasma Applications for Aluminum Supplement.

You may also view the general benefits and uses of e-Ion Plasma™ technology in the Plasma Ideation Brochure.

 


MHI (Micropyretics Heaters International Inc.)

750 Redna Terrace

Cincinnati, OH 45215, USA

      513-772-0404 phone

513-672-3333 fax

Delivering Quality Since 1995

 

Contact MHI to design the best solution for your application.

© Micropyretics Heaters International Inc. 1995 - 2013